Researchers at HSE University, in collaboration with colleagues from the Lebedev Physical Institute of the Russian Academy of Sciences (FIAN), have developed a method for rapidly determining how firmly a film is bonded to a substrate. This is important for the creation of ultrahigh-frequency acoustic filters, which are key components of next-generation 5G and 6G communications. For the first time, researchers have succeeded in measuring the lateral rigidity of the bond between a two-dimensional material film and a substrate in this way. The study results have been published in
Applied Physics Letters.